123ArticleOnline Logo
Welcome to 123ArticleOnline.com!
ALL >> Business >> View Article

Lucintel Forecasts The Global Advanced Semiconductor Packaging Market To Reach $47 Billion By 2030

Profile Picture
By Author: Lucintel LLC
Total Articles: 6576
Comment this article
Facebook ShareTwitter ShareGoogle+ ShareTwitter Share

According to a market report by Lucintel, the future of the global advanced semiconductor packaging market looks promising with opportunities in the automotive, aerospace and defence, medical device, and consumer electronics markets. The global advanced semiconductor packaging market is expected to reach an estimated $47 billion by 2030 from $30 billion in 2024, at a CAGR of 7.6% from 2024 to 2030. The major drivers for this market are rising adoption of electronic devices, increasing focus on wafer-level packages, as well as, growing investments and R&D in semiconductor packaging technologies.
A more than 150-page report to understand trends, opportunity and forecast in global advanced semiconductor packaging market to 2030 by type (fan-out wafer level package, 5D/3D, fan-in wafer level package, and flip chip), application (automotive, aerospace and defence, medical devices, consumer electronics, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World).
Lucintel forecasts that fan-out wafer level package will remain the largest segment over the forecast period due to its superior ...
... electrical performance, high connector density, and small form factor.
Download sample by clicking on advanced semiconductor packaging market.
APAC will remain the largest segment over the forecast period due to region’s increasing demand for innovative packaging technologies, rapid developments and expansion of automotive, and consumer electronics industries, as well as the rise of emerging technologies like 5G, AI, and IoT.
Advanced Semiconductor Engineering, Intel, Advanced Micro Devices, Amkor Technology, Hitachi Chemical, Jiangsu Changjiang Electronics Technology, Infineon, Kyocera, Sumitomo Chemical, China Wafer Level CSP are the major suppliers in the advanced semiconductor packaging market.
This unique research report will enable you to make confident business decisions in this globally competitive marketplace. For a detailed table of contents, contact Lucintel at +1-972-636-5056 or write us at helpdesk@lucintel.com. To get access of more than 1000 reports at fraction of cost visit Lucintel's Analytics Dashboard.
About Lucintel
At Lucintel, we offer solutions for you growth through game changer ideas and robust market & unmet needs analysis. We are based in Dallas, TX and have been a trusted advisor for 1,000+ clients for over 20 years. We are quoted in several publications like the Wall Street Journal, ZACKS, and the Financial Times.
Contact:
Roy Almaguer
Lucintel
Dallas, Texas, USA
Email: roy.almaguer@lucintel.com
Tel. +1-972-636-5056
Explore Our Latest Publications
Fluoroelastomer Market
Foam Core Acrylic Market
Foundry Coke Market
Free Painting Color Masterbatch Market
Fumed Silica Market
Geosteering Market

Total Views: 28Word Count: 380See All articles From Author

Add Comment

Business Articles

1. Lucintel Forecasts The Global Phenanthrene Market To Grow With A Cagr Of 4.5% From 2025 To 2031
Author: Lucintel LLC

2. Lucintel Forecasts The Global Peristaltic Pump Silicone Tubing Market To Grow With A Cagr Of 5.6% From 2025 To 2031
Author: Lucintel LLC

3. Hiring A Mobile App Testing Company For Your App Success
Author: Arnav Goyal

4. Essentials And Characteristics Of Corporate Fixed Deposits
Author: Ravi Fernandes

5. Lucintel Forecasts The Global Pcb Mechanical Drilling Machine Market To Grow With A Cagr Of 5.8% From 2025 To 2031
Author: Lucintel LLC

6. Lucintel Forecasts The Global Passenger Car Dc Charging Gun Market To Grow With A Cagr Of 12.9% From 2025 To 2031
Author: Lucintel LLC

7. Lucintel Forecasts The Global Parcel Separator Market To Grow With A Cagr Of 15.5% From 2025 To 2031
Author: Lucintel LLC

8. Nickel Alloys Round Bar: Strength, Performance, And Industrial Excellence
Author: pipex.ai

9. The Cfo's Vendor Selection Checklist For F&a Outsourcing Partners
Author: Harsh Vardhan

10. Lucintel Forecasts The Global Paraphenylenediamine Market To Grow With A Cagr Of 5.2% From 2025 To 2031
Author: Lucintel LLC

11. Ai In Finance And Accounting: What It Means For The Modern Cfo
Author: Ashish Gupta

12. Why Choose No Sugar Protein Bars? Is Canada A Smart Nutrition Moves?
Author: Alinaa maryam

13. The Ultimate Mint Chocolate Protein Bar, A Canadian Snack For Clean Energy
Author: Alinaa maryam

14. Digital Printing Machine Price In India 2026 – Complete Buyer’s Guide
Author: ronald web offset

15. Private Equity Vehicles In Luxembourg | Private Equity Funds Luxembourg-nomilux
Author: digicreator

Login To Account
Login Email:
Password:
Forgot Password?
New User?
Sign Up Newsletter
Email Address: