Does Core Technology Matter? How Does Die Technology Affect The Development Of The Automotive Sector?

By Author: Luosi
Total Articles: 2
Comment this article

Core is a pre-manufactured wafer with specific functions that can be combined and integrated. There are several comprehensive introductions to core technology on the Internet. In order to enhance your understanding of die, this article will introduce die and its role in the automotive field. If you are interested in die, you may want to read on.

Diameters are small modular chips that can be combined to form a complete System on Chip (SoC). They are designed for use in die-based architectures, where multiple dies are connected together to create a single complex integrated circuit. Die-based architectures offer several advantages over traditional monolithic SoCs, including improved performance, reduced power consumption, and increased design flexibility. Die technology is relatively new and is being actively developed by many companies in the semiconductor industry.

Die is a new type of chip that paves the way for designing complex SoCs. Dielectrics can be thought of as a high-tech version of Legos. A complex function is broken down into small modules, followed by a die that can perform a specific function very ...
... efficiently. Thus, an integrated system using mandrels can include: data storage, signal processing, computation, and data flow management, constructed in what is known as a “morsel”.

A die is part of a package architecture, which can be defined as a physical piece of silicon that encapsulates an IP (Intellectual Property) subsystem with other dies using a package-level integration approach. Die technology can be described as the integration of multiple electrical functions in a single package or system.

With die technology, engineers can quickly and cost-effectively design complex chips by assembling different types of third-party IP into a single chip or package. These third-party IPs can be I/O drivers, memory ICs, and processor cores.

The idea for cores originated in the DARPA CHIPS (Common Heterogeneous Integration and IP) program. Since state-of-the-art SoCs are not always suitable for small-scale applications, the CHIP program sought to create a new paradigm for IP reuse, known as cores, in order to improve overall system flexibility.

While computer technology in most of today's electronic devices is still largely dominated by legacy chipsets, it seems clear that this trend will change over time. Many experts believe that as these advanced technologies evolve, specialized die will become a common feature of consumer devices. There are many reliable and cheaper technologies that can be used to design dies.

Moore's Law, a prediction made by Intel co-founder Gordon Moore in 1965, predicts that the number of transistors on a microchip will double roughly every two years, leading to exponential growth in computing power and lower costs. Die technology can be seen as a way to extend Moore's Law and continue the semiconductor industry's trend of increasing performance and reducing costs.

One way die technology can help extend Moore's Law is by allowing the creation of more complex and powerful SoCs without having to fit all the necessary components onto a single chip. By breaking down complex SoCs into smaller modular dies and connecting them together, the number of transistors and other components can continue to expand without reaching the physical limits of a single chip. This helps keep pace with the performance improvements and cost reductions predicted by Moore's Law.

Today, the heterogeneous die integration market is growing even faster, with microprocessors as diverse as AMD's Epyc and Intel's Lakefield being mass-produced using die designs and heterogeneous integrated packaging technologies.

In the automotive field, “the impact of die technology on in-vehicle chips and the smart car industry will be mainly reflected in improving the level of automotive computing power, reducing ‘computing power anxiety’, and standardizing the automotive chip standard to create an external environment for future automotive interconnectivity; after standardization and validation, it will help reduce the chip validation cycle and enrich the automotive chip function. chip verification cycle, enrich automotive chip functions and expand application scenarios.” Liu Bo said.

The automotive-grade core system chip shows many significant advantages: first, it effectively breaks through the limitations of traditional packaging technology, significantly improves interconnection bandwidth, reduces packaging costs, and provides a more flexible and efficient solution for the automotive electronic electronic control system; second, it fully takes into account the strict requirements of the automotive industry for environmental adaptability, real-time, determinism, functional safety, information security, low-power consumption, and fault detection and fault tolerance, etc. in the beginning of design. Secondly, the automotive industry's stringent requirements for environmental adaptation, real-time, deterministic, functional safety, information security, low power consumption, fault detection and fault tolerance are fully considered at the beginning of the design. In addition, the design methodology of automotive-grade core system-on-chip (SoC) - core-level IP multiplexing and prefabricated combinations - has injected new vitality into the rapid development of automotive electronic electronic control systems. By carefully selecting and combining cores with different functionalities, customized chips can be rapidly constructed to meet specific needs, significantly shortening the time from design to market. cycle.

“The core particle system belongs to a relatively new technology business, there is a certain gap between China's chip manufacturing level and the world's advanced level, but the difference between the chip packaging capability and the world's advanced level is relatively small, so we are optimistic about the future development space in this application field which mainly relies on packaging technology.” Liu Bo said that leading domestic semiconductor companies such as Huawei, etc., have been in the layout of the core particle system required for the packaging substrate, equipment and technology investment, proceed to technical verification and testing. Although the localization rate of automotive-grade chips was low in the past, with the development of the last few years, the localization level of low- and mid-range products has been increasing. In the core of this new technology field, domestic and foreign enterprises are actually in the early stages of development, if the whole and the two sides work closely together, the domestic chip will get more “on the car” opportunity.
More article:https://www.emsfpga.com/