Lucintel Forecasts The Global Three-dimensional Integrated Circuit & Through-silicon Via (tsv) Interconnect Market To Reach $37 Billion By 2030

By Author: Lucintel LLC
Total Articles: 6221
Comment this article

According to a market report by Lucintel, the future of the global three-dimensional integrated circuit & through-silicon via (TSV) interconnect market looks promising with opportunities in the military, aerospace and defense, consumer electronics, information and communication technology, and automotive markets. The global three-dimensional integrated circuit & through-silicon via (TSV) interconnect market is expected to reach an estimated $37 billion by 2030 from $20 billion in 2024 at a CAGR of 10.7% from 2024 to 2030. The major drivers for this market are increasing need for decreased energy consumption and enhanced density, growing adoption of 3D IC and TSV interconnect solutions, and rising demand of high-performance and miniaturized electronic devices.
A more than 150-page report to understand trends, opportunity and forecast in global three-dimensional integrated circuit & through-silicon via (TSV) interconnect market to 2030 by technology (silicon on insulator and bulk silicon), product (memories, light emitting diodes, sensors, power and analog components, micro electro mechanical systems, and others), ...
... bonding technique (die to die, die to wafer, wafer to wafer, direct bonding, adhesive bonding, and metallic bonding), application (military, aerospace and defense, consumer electronics, information and communication technology, automotive, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World).
Lucintel forecasts that silicon on insulator will remain the larger segment over the forecast period.
Through this market, aerospace & defense is expected to witness the highest growth over the forecast period.
Download sample by clicking on three-dimensional integrated circuit & through-silicon via (TSV) interconnect market.
APAC will remain the largest region over the forecast period due to increasing need for silicon wafers in smartphone manufacturing and rising adoption of 5G technology in the region.
Amkor Technology, Elpida Memory, Intel Corporation, Micron Technology, Monolithic 3d, Renesas Electronics Corporation are the major suppliers in the three-dimensional integrated circuit & through-silicon via (TSV) interconnect market.
This unique research report will enable you to make confident business decisions in this globally competitive marketplace. For a detailed table of contents, contact Lucintel at +1-972-636-5056 or write us at helpdesk@lucintel.com. To get access of more than 1000 reports at fraction of cost visit Lucintel's Analytics Dashboard.
About Lucintel
At Lucintel, we offer solutions for you growth through game changer ideas and robust market & unmet needs analysis. We are based in Dallas, TX and have been a trusted advisor for 1,000+ clients for over 20 years. We are quoted in several publications like the Wall Street Journal, ZACKS, and the Financial Times.
Contact:
Roy Almaguer
Lucintel
Dallas, Texas, USA
Email: roy.almaguer@lucintel.com
Tel. +1-972-636-5056
Explore Our Latest Publications
Composites in The Aerospace Interior Market
Composite Surface Film Market
FRP Pole Market to 2030
Composites in the Global Construction Market to 2030
Brazilian Composites Market
BRIC Composites Market