E&r Engineering Debuts Advanced Solutions At Semicon Sea 2024

By Author: Ben Gross
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E&R Engineering Corp., a leading provider of advanced laser and plasma solutions from Taiwan, will be participating in Semicon SEA 2024 in Kuala Lumpur, Malaysia. With 30 years of experience in the semiconductor industry, E&R has developed a wide range of plasma and laser technologies. During the event, they will be showcasing their latest solutions, which include:

Plasma Dicing – Small Die Dicing Solution

E&R offers a hybrid solution that combines laser grooving and plasma dicing, allowing for dice lanes controlled between 10um ~ 30um. Apart from equipment manufacturing, E&R also provides one-stop-shop dicing services (outsourcing services) to process wafers into small dies of various shapes, such as hexagonal, circular, or MPR pattern.

Advanced Packaging:

Leveraging their extensive expertise in integrating self-developed optics modules and advanced laser systems, E&R provides a laser drilling solution for 2.5D/3D packaging with high accuracy up to +/- 5um and a B/T ratio of 85~90%. Additionally, E&R is well-known for its precision laser marking integrated with a 4-beam marking solution for high throughput while maintaining +/- 25um accuracy, excellence in heat affect control for laser cutting processes, and high uniformity (CPK >1.33) plasma solutions.

More Information : https://www.techdogs.com/tech-news/pr-newswire/er-engineering-corp-unveils-cutting-edge-solutions-at-semicon-sea-2024-in-kuala-lumpur