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Global Pin Fin Heat Sink For Igbt Market Is Expected To Reach $1285.7 Million By 2030- An Exclusive Market Research Report By Lucintel
Lucintel's latest study found that, the future of the global pin fin heat sink for IGBT market looks promising with opportunities in the automotive field and consumer electronic applications. The global pin fin heat sink for IGBT market is expected to reach an estimated $1285.7 million by 2030 with a CAGR of 5.6% from 2024 to 2030. The major drivers for this market are increasing demand for efficient cooling solutions in modern electronics, rising use of IGBTs across various automated industries,and growing application of this device in hybrid and electric vehicles.
In this market, aluminium and copper are the major segments of pin fin heat sink for IGBT market by material type.
Lucintel forecast that aluminium is expected to witness higher growth over the forecast period due to its significant use by manufacturers owing to its excellent thermal conductivity, flexibility, and cost-effectiveness.
Browse in depth TOC of the pin fin heat sink for IGBT Market
100 - Figures
150-Pages
The pin fin heat sink for IGBT market is marked by presence of several big and small players.
This unique ...
... research report will enable you to make confident business decisions in this globally competitive marketplace. For a detailed table of contents, contact Lucintel at +1-972-636-5056 or click on this link helpdesk@lucintel.com.
About Lucintel
Lucintel, the premier global management consulting and market research firm, creates winning strategies for growth. It offers market assessments, competitive analysis, opportunity analysis, growth consulting, M&A, and due diligence services to executives and key decision-makers in a variety of industries.
Contact:
Roy Almaguer
Lucintel
Dallas, Texas, USA
Email: roy.almaguer@lucintel.com
Tel. 972.636.5056
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