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Lucintel Forecasts Capillary Underfill Material Market To Grow At A Cagr Of 8% To 10% From 2020 To 2025

According to the recent study the capillary underfill material market is projected to grow at a CAGR of 8% to 10% from 2020 to 2025. Growth in this market is primarily driven by growth in the electronics industry.
Browse XX figures / charts and XX tables in this 150 -page report to understand trends, opportunities and forecast in capillary underfill material market by product type (molded underfill material, no flow underfill material, and others), applications (chip scale packaging, flip chips, ball grid array, and others), and region (North America, Europe, Asia Pacific (APAC), and Rest of the World (ROW).
Download sample report and view detailed Table of Content by clicking on below link https://www.lucintel.com/capillary-underfill-material-market.aspx
“Flip-chip market is expected to remain the largest segment during the forecast period.”
Based on application, the capillary underfill material market is segmented into chip scale packaging, flip chips, ball grid array, and others. Lucintel forecasts that the flip-chip market is expected to remain the largest segment due to the demand for smaller, ...
... lighter, and cost-effective devices, and the attention on capillary underfill material.
“Asia pacific will dominate the capillary underfill material market in near future.”
Asia-Pacific will remain the largest region and it is also expected to witness the highest growth over the forecast period due to growth of the semiconductor industry.
Download Brochure of this report by clicking on https://www.lucintel.com/capillary-underfill-material-market.aspx
Major players of capillary underfill material market are adopting various growth strategies like new product launches, expansions, merger and acquisitions, partnerships, agreements, and collaborations to expand their presence in this market. Zymet, Epoxy Technology Inc., H.B. Fuller, Henkel Ag & Co. Kg, Namics Corporation, Nordson Corporation, Yincae Advanced Material, LLC, Master Bond are among the major capillary underfill material providers.
This unique research report will enable you to make confident business decisions in this globally competitive marketplace. For a detailed table of contents, contact Lucintel at +1-972-636-5056 or click on this link https://www.lucintel.com/capillary-underfill-material-market.aspx or helpdesk@lucintel.com
About Lucintel
At Lucintel, we offer solutions for you growth through game changer ideas and robust market & unmet needs analysis. We are based in Dallas, TX and have been a trusted advisor for 1,000+ clients for over 20 years. We are quoted in several publications like the Wall Street Journal, ZACKS, and the Financial Times. For further information, visit www.lucintel.com.
Contact:
Brandon Fitzgerald
Lucintel
Dallas, Texas, USA
Email: brandon.fitzgerald@lucintel.com
Tel. 972.636.5056
Cell: 303.775.0751
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