123ArticleOnline Logo
Welcome to 123ArticleOnline.com!
ALL >> Business >> View Article

Redistribution Layer Material Market Perceive Robust Expansion By 2018-2027

Profile Picture
By Author: Sameer Joshi
Total Articles: 7
Comment this article
Facebook ShareTwitter ShareGoogle+ ShareTwitter Share

Manufacturing of consumer electronics, healthcare related products, automobiles, and defense industries are some of the prominent industry verticals that have been prolific in the automation integrations into the manufacturing assembly lines. Automation integration requires additional functionalities to be added on the chips for translating the manual operations to automated ones. Increasing the functionalities on chips while maintaining the size of the chip is made possible with the help of redistribution layer material and therefore, these manufacturing sectors are anticipated to drive the demands for redistribution layer material drastically during the forecast period.
The global redistribution layer material market accounted to US$ 105.4 Mn in 2018 and is expected to grow at a CAGR of 25.7% during the forecast period 2019 - 2027, to account to US$ 794.5 Mn by 2027. 
The global redistribution layer material market by material was led by polyimide segment. The other materials for redistribution layer material market include FEpoxy (phenol & acrylates based), metal and Silicones. A polymer material is required for redistribution layer in the advanced packaging techniques that catalyzes in routing the connection between the solder bumps and the I/O pads. The materials used for redistribution are used as passivation layer for bumping and stress buffers. There are a certain set of physical characteristics required in the dielectric material used for RDL in the advanced packaging applications that include low cure temperature, low dielectric constant, higher chemical and mechanical stabilities.
Market Insights

Growing trends of miniaturization of consumer electronic devices to create more demands for Redistribution layer material
Proliferation of IoT and connected devices across industry verticals to create further more opportunities

Strategic Insights
The market players present in redistribution layer material market are mainly focusing towards product enhancements by implementing advance technologies. By signing partnership, contracts, joint ventures, funding, and inaugurating new offices across the world permit the company maintain its brand name globally. Most of the market initiative were observed in Asia Pacific, North America, Europe regions, which have high density of semiconductor manufacturing industries. Few of the recent developments are listed below:
2018: Sumitomo Bakelite Co., Ltd. and Sumitomo Dainippon Pharma Co., Ltd. together announced the establishment of a new joint company, SB Bioscience Co., Ltd. By combining the know-how of in-vitro diagnostics of DS Pharma Biomedical Co., Ltd. and the technologies of Sumitomo Bakelite Co., Ltd., both the companies focus to accelerate new diagnostics development and make a further contribution to the society.

2018: ASE Group unveiled its plan to build K25 Factory Building in Kaohsiung. The K25 building will be ASE’s state of the art facility with an intelligent manufacturing processes, high degree of automation, and smart logistics.

2018: Advanced Semiconductor Engineering, Inc. collaborated with Cadence Design Systems, Inc. to release a System-in-Package (SiP) EDA solution that addresses the challenges of designing and verifying Fan-Out Chip-on-Substrate (FOCoS) multi-die packages. This solution handles heterogeneous and homogeneous chip integration with high-density packaging to enhance the efficiency of chip and passive design optimization.
Company Profiles

Advanced Semiconductor Engineering, Inc. (ASE group)
Amkor Technology, Inc.
Fujifilm Holdings Corporation
Hitachi Chemical DuPont MicroSystems L.L.C.
Infineon Technologies AG
Jiangsu Changjiang Electronics Technology Co., Ltd.(JCET)
NXP Semiconductors N.V.
Samsung Electronics Co. Ltd
Shin-Etsu Chemical Co., Ltd.
Sumitomo Bakelite Co., Ltd
The Dow Chemical Company
Toray Industries, Inc.
Taiwan Semiconductor Manufacturing Company Ltd.

APAC was the leading geographic market and it is anticipated to be the highest revenue contributor throughout the forecast period.  The presence of large semiconductor manufacturing industry in the countries like South Korea, China, Taiwan, and Japan, is expected to fuel growth of redistribution layer material market in this region.
The advent of IoT has enabled each device to be connected over the internet and the rising adoptions globally would result in more than billions of devices connected over the internet. Also, validating to the above mentioned point is the fact that the data traffic rate on a global level, has grown at an annual rate of more than 65% over the last five years. Also, between 2018 and 2023, the data traffic is anticipated to grow at a compound annual growth rate of close to 40 percent. This exponential growth in data traffic over the internet is out rightly attributed to the growing penetration of smartphones and other consumer electronic devices that can be connected over the internet as a result of the growing popularity of IoT.
The redistribution layer material market by end use is segmented into Fan-Out Wafer Level Packaging (FOWLP) and 2.5D/3D IC Packaging. Advanced packaging techniques integrate multiple die in a single package and thereby ensure in reducing the device footprint. Also, integrating multiple-die in a single package ensures, multiple functionalities of the device in a small form factor. The majorly used advanced packaging techniques have been broadly categorized under two segments namely Fan-out Wafer Level Packaging (FOWLP) and 2.5D/3D IC packaging. Redistribution layers find their applications in these advanced level packaging where they are placed for resolving issues related to heat dissipation, elongation of battery life, and enhancement of the performance.

By Material
Polyimide (PI)
Polybenzoxazole (PBO)
Benzocylobutene (BCB)

By Application

2.5D/3D IC Packaging

By 2.5D/3D IC Packaging

High Bandwidth Memory (HBM)
Multi-Chip Integration
Package on Package (FOPOP)

By Geography

North America

Rest of North America


Rest of Europe

Asia Pacific (APAC)

South Korea
Rest of APAC

Rest of World (RoW)

Total Views: 45Word Count: 851See All articles From Author

Add Comment

Business Articles

1. Heavy Plastic Will Lead Sustainability Movement In The Post-pandemic World Order
Author: Michael Luis

2. Why Engineering Consultancy And Its Services Are Important In Different Industrial Sectors
Author: Elegrow Technology

3. Webinar #21 Second Phase – A Billtrust Solution
Author: NSA COM

4. Tailor Made Music Lessons
Author: Judith Muir

5. Mitigating The Dangers Of Lead Paint Removal
Author: Bryson Kaleb

6. Love Marriage Specialist In Victoria | Vashikaran Specialist In Victoria
Author: master sadashiv

7. Muthoot Finance Ncd : Muthoot Finance Limited Ncd Opens On Sep 27
Author: dariya

8. Manappuram Home Finance Ncd From Sep 30, 2019 To Oct 29, 2019
Author: dariya

9. Icici Prudential Life Insurance Shares Tumbled: Stocks
Author: dariya

10. Hindustan Construction Company Ltd. Shares Gained 1%
Author: dariya

11. How You Can Apply For The Dealership Of Any Gas Agency?
Author: lpgvitarakchayans

12. Top 12 Stocks To Buy For The Next 2 Weeks
Author: Stock Investor

13. What Is Water Management And How It Is Accomplished By A Property Preservation Company?
Author: RPR Services, LLC

14. Healthcare Bpo Companies: Medical Innovation And Solution
Author: Allan Jones

15. Kryptorganic
Author: Ruhbi Cabasbas

Login To Account
Login Email:
Forgot Password?
New User?
Sign Up Newsletter
Email Address: