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Opportunities For The Global Probe Card Market To Reach $2 Billion By 2023

By Author: Lucintel
Total Articles: 185

According to a new market report published by Lucintel, the future of the probe card market looks attractive with opportunities in the electrical testing of the integrated circuit in the semiconductor industry. The global probe card market is expected to reach an estimated $2 billion by 2023 with a CAGR of 4.5% from 2018 to 2023. The major growth drivers for this market are increasing demand for integrated circuits (ICs), growth in high-frequency testing, and increase in wafer size.
In this market, advanced and standard probe cards are used for electrical testing of ICs. Lucintel forecasts that advanced probe card will remain the largest product type and witness the highest growth during the forecast period as it eliminates the limitations related to probe area, pad layout, and extreme environment conditions.
Probe cards are used for electrical testing of different types of IC such as, foundry & logic, DRAM (Dynamic random-access memory), and flash. Foundry & logic will remain the largest type and witness the highest growth during the forecast period supported by the growth of semiconductor industry
Asia Pacific is expected to remain the largest region and witness the highest growth during the forecast period supported by increasing production of integrated circuit in Taiwan, South Korea, Japan, and China. The presence of prominent IC manufacturers in these countries is also leading the demand for this region.
Emerging trends, which have a direct impact on the dynamics of the industry, include the development of probe card to reduce the cost of testing and introduction of die stacking for advanced 2.5D and 3D stacked packages. FormFactor, Micronics Japan Co., Technoprobe, Japan Electronic Materials, MPI Corporation, Nidec SV TCL, Microfriend, Korea Instrument, Will Technology, and TSE are among the major probe card providers.
Lucintel, a leading global strategic consulting and market research firm, has analyzed the global probe card market by product type, manufacturing technology, IC type, and region and has come up with a comprehensive research report entitled “Growth Opportunities in the Global Probe card Market 2018-2023: Trends, Forecast, and Opportunity Analysis.” The Lucintel report serves as a catalyst for growth strategy as it provides comprehensive data and analysis on trends, key drivers, and directions. The study includes a forecast for the global probe card by product type, manufacturing technology, IC type, and region as follows:
By Product Type [$M shipment analysis from 2012 to 2023]:
• Advanced
• Standard
By Manufacturing Technology [$M shipment analysis from 2012 to 2023]:
• MEMS
• Vertical
• Cantilever
• Others
By IC Type [$M shipment analysis from 2012 to 2023]:
• Foundry & Logic
• DRAM
• Flash
By Region [$M shipment analysis for 2012 – 2023]:
• North America
 United States
 Canada
 Mexico
• Europe
 United Kingdom
 Germany
 Italy
• Asia Pacific
 Taiwan
 South Korea
 Japan
• The Rest of the World
This 160 page research report will enable you to make confident business decisions in this globally competitive marketplace. For a detailed table of contents, contact Lucintel at +1-972-636-5056 or helpdesk@lucintel.com. Lucintel offerings include Telecommunication Report, Telecommunication Market Report, Opportunity Screening and Analysis, Capital Investment Feasibility and SWOT Matrix.

About Lucintel
Lucintel, the premier global management consulting and market research firm, creates winning strategies for growth. It offers market assessments, competitive analysis, opportunity analysis, growth consulting, M&A, and due diligence services to executives and key decision-makers in a variety of industries. For further information, visit www.lucintel.com.

This report answers following 11 key questions:

Q.1 What are some of the most promising, high-growth opportunities for the global probe card market by product type (standard and advanced), by manufacturing technology (MEMS, Cantilever, Vertical, and Others), by IC type (DRAM, Flash, and Foundry & Logic), and by region (North America, Europe, Asia Pacific, and the Rest of the World)?
Q.2 Which segments will grow at a faster pace and why?
Q.3 Which regions will grow at a faster pace and why?
Q.4 What are the key factors affecting market dynamics? What are the drivers and challenges of the market?
Q.5 What are the business risks and threats to the market?
Q.6 What are the emerging trends in this market and reasons behind them?
Q.7 What are some changing demands of customers in the market?
Q.8 What are the new developments in the market? Which companies are leading these developments?
Q.9 Who are the major players in this market? What strategic initiatives are being implemented by key players for business growth?
Q.10 What are some of the competitive products and processes in this area and how big of a threat do they pose for loss of market share via product substitution?
Q.11 What M&A activity has occurred in the last 5 years?

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