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Different Techniques Of Pcb Assembly

By Author: jazzjessika
Total Articles: 58

Printed Circuit Boards are the essential parts of most of the modern day electronic devices. It is these boards which held different component, particularly resistors, chips and transistors together and ensure connectivity among them. Depending on the size and nature of the device, these boards are ranged from simple, single layer boards to complex, multilayer boards. These are generally made up with different insulating material like glass reinforced plastic and fiberglass etc. In order to ensure conductive pathways copper tracks are etched into it by various methods. These boards are often laminated and coated on both the sides. Assembling constitutes the most important aspect, besides manufacturing in the production of PCBs.

Assembly:

PCB Assembly constitutes a significant process in the overall production of PCBs. Here where different components are attached to the board. The resistors, chips and various other circuits of different sizes and nature would be fixed on to the board in this process. It is done by various techniques depending on the nature of circuit. The connection of various components, which are likely to concealed with in different layers need to be ensured. The leads of various components are properly exposed outside so as to complete the circuiting properly. The main techniques of assembly include; through-hole technique and surface- mount technique.

Through-hole Technique:

This technique is generally used to single layer boards. Components are inserted into the board by drilling into the board. It places the components firmly in to the board. So, components can be made to withstand a physical strain to a great extent. These single layer boards are mostly simple circuits. The holes are drilled into the boards and components are inserted and adhesives are used to fix the components firmly to the boards.

Surface- mount Technique:

The other technique used to assemble the PCBs is Surface-mountain. This method is generally used for multi layered, large and complex circuits. Different components are concealed under different layers in this process depending on their utility in the circuit. It is very much important to test the components and the connecting circuits rigorously before laminating, as it can’t be changed after the lamination. Laminating and soldering are other important tasks involved in this technique.

Interestingly, both the techniques are used for assembling most of the circuits. The modern day electronic though seems simple the structure is incredibly complex. Hence it demands different techniques in single boards. As size and functional efficacy of the device determines the multiple circuits. Since the size of a device can’t be increased the demand for clubbing two methods to build compound circuits.

This article is written by an expert author, who is long associated with different aspects of PCB Assembly.

Total Views: 95Word Count: 441See All articles From Author

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